PACK EXPO International is the premier event for packaging, processing, and automation professionals—bringing together more than 2,500 exhibitors and thousands of industry leaders. This year, Daifuku is excited to showcase advanced intralogistics solutions designed to help manufacturers move faster, smarter, and more efficiently.

Whether you're looking to boost throughput, optimize labor, or modernize your end‑to‑end material flow, our team is ready to help you engineer the future of your operation.
Discover how Daifuku's portfolio of conveyors, sortation systems, shuttle solutions, AS/RS, AGVs, and AMRs can unlock new levels of productivity across packaging and processing environments.Our solutions are designed to improve efficiency, scalability, and performance—helping you stay ahead in fast‑moving markets.
See our latest technologies up close with hands‑on demonstrations, interactive displays, and real‑time system insights. Learn how intelligent automation, advanced software, and engineered material flow can transform your packaging operations.
Book time with Daifuku’s specialists to discuss your challenges, explore new ideas, and design solutions tailored to your facility.From throughput and labor optimization to high‑density storage and end‑of‑line automation, our team is here to help you engineer what’s next.
Chicago’s McCormick Place will host the show, offering an immersive environment for exploring technologies shaping the future of packaging and processing.Learn more at the official PACK EXPO website
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