PACK EXPO International is the premier event for packaging, processing, and automation professionals—bringing together more than 2,500 exhibitors and thousands of industry leaders. This year, Daifuku is excited to showcase advanced intralogistics solutions designed to help manufacturers move faster, smarter, and more efficiently.

Whether you're looking to boost throughput, optimize labor, or modernize your end‑to‑end material flow, our team is ready to help you engineer the future of your operation.
Step into the future of material handling with Daifuku’s SOTR Series and RDS (Robotic DepalSystem), alongside our full suite of conveyors, sortation systems, shuttle solutions, AS/RS, AGVs,and AMRs. Explore how these cutting-edge technologies can unlock new levels of productivity,efficiency, and flexibility across your packaging and processing operations.
Whether it’s boosting throughput, optimizing labor, or creating high-density storage solutions, oursystems are designed to help you stay ahead in fast-moving markets.
Connect with Daifuku’s experts and dive deep into your unique operational challenges. From end-of-line automation to intelligent depalletizing and sortation, we’ll help you explore new ideas,design tailored solutions, and engineer the next generation of efficiency for your facility.
Don’t just see automation experience it. Discover how the SOTR Series and RDS are redefiningwhat’s possible.
Chicago’s McCormick Place will host the show, offering animmersive environment for exploring the technologies shaping the future of packaging and processing. Learn more on the official PACK EXPO website.

Explore how Daifuku’s SOTR Series and RDS (Robotic Depal System) deliver smarter, faster, and more adaptive automation for today’s high‑demand production environments.
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Daifuku’s long-standing expertise—spanning conveyors, robotics, automated storage, and integrated software—helps businesses build operations that are more resilient, efficient, and future‑ready.
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